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Article Information:
Thermal Stresses in an Anisotropic Thin Plate Subjected to Moving Plane Heat Sources
Malak Naji, Moh'd Al-Nimr, Eyad Alsyed and Mahir Es-Saheb
Corresponding Author: Malak Naji
Submitted: November 04, 2013
Accepted: December 04, 2013
Published: April 25, 2014 |
Abstract:
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The aim of this study is to numerically simulate the plane moving heat source through anisotropic mild steal thin plate. Heat conduction problems in anisotropic material, where the thermal conductivity varies with direction and involving a moving heat source have several industrial applications, such like metal cutting, flame or laser hardening of metals, welding and others. The parabolic heat conduction model is used for the prediction of the temperature history. The temperature distribution inside the plate is determined from the solution of heat equation. Thus, the heat equation is solved numerically using finite deference method and the temperature distributions are determined. The thermal stresses in this case are, also, investigated and computed numerically. It is found that the thermal conductivity ratio affect in both temperature and thermal stresses distributions, in additional to the speed and heat source intensity.
Key words: Anisotropic, heat conduction model, moving plane heat source, parabolic heat conduction model, thermal stresses, ,
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Cite this Reference:
Malak Naji, Moh'd Al-Nimr, Eyad Alsyed and Mahir Es-Saheb, . Thermal Stresses in an Anisotropic Thin Plate Subjected to Moving Plane Heat Sources. Research Journal of Applied Sciences, Engineering and Technology, (16): 3395-3404.
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ISSN (Online): 2040-7467
ISSN (Print): 2040-7459 |
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