Abstract

This study presents the fabrication process and analysis of micro contact probe cell for IC testing deposited by dc sputtering technique on a glass substrate. It is designed to solve and replace pogo pins in IC testing process. In previous study, the new model of test socket with new materials in different shapes were designed by using ANSYS as Finite Element Analysis (FEA) software and the best parameter were obtained. According to the optimized parameters, prototype structures of the micro-contacts are fabricated using DC Sputtering with materials like copper and tungsten on base copper on glass substrates. Micro contact with thickness of 2800-7000 nm were successively deposited on glass substrate at sputtering power of 125 W in argon ambient gas with pressure of 10-1510-3 Torr at a room temperature. The structural and electrical properties of micro contact were investigated by using profilometer, Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM) and four point probes. Results show that the film thickness increased as the deposition the time getting longer. The Root Mean Square (RMS) roughnesses obtained are all in a good quality. On the other hand, the resistivity of micro contacts was less than 4 uΩ-cm, which has good conductive properties. Consequently, this design is appropriate for replacing the conventional pogo pin based testing tools.

Keywords:

DC sputtering deposition , micro contact, pogo pin , test socket,

References

Competing interests

The authors have no competing interests.

Open Access Policy

This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.

Copyright

The authors have no competing interests.