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     Research Journal of Applied Sciences, Engineering and Technology


The Lead-Free Solder Selection Method and Process Optimization Based on Design of Experiment

Wang Bing
Institute of Mechanical Engineering, Huaihai Institute of Technology, Lianyungang 222005, China
Research Journal of Applied Sciences, Engineering and Technology  2013  7:1218-1221
http://dx.doi.org/10.19026/rjaset.6.3934  |  © The Author(s) 2013
Received: September 25, 2012  |  Accepted: November 13, 2012  |  Published: July 05, 2013

Abstract

In the study, through researching the characteristic of the lead-free solder, we introduce the method of QFD (Quality Function Deployment) to transform the demand of production properties and process into the technical demand of the lead-free solder, thus we could transform the demand concept of sampling into a concrete performance index. Finally we can obtain two parameters of the technological competitive power index and market competitive power index to evaluate performance of the lead-free solder through making a series of experiments. We utilize the design of experiment method to find out key parameter of process and the best collocation of parameter, which make the co planarity of tin ball descend to 149 from 178 and promote the process’s ability up to 95.2 from 85%.

Keywords:

Design of experiment, lead-free solder, quality function deployment, restriction of hazardous substances,


References


Competing interests

The authors have no competing interests.

Open Access Policy

This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.

Copyright

The authors have no competing interests.

ISSN (Online):  2040-7467
ISSN (Print):   2040-7459
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