Research Article | OPEN ACCESS
Deposition of Micro Contact Based Probe Cell for IC Testing by Dc Magnetron Sputtering Technique
1, 2M. Idzdihar Idris, 2Nowshad Amin, 1Faiz Arith and 2S.A.M. Chachuli
1Faculty of Electronic and Computer Engineering, Universiti Teknikal Malaysia Melaka,
Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia
2Solar Energy Research Institute, Universiti Kebangsaan Malaysia, UKM, Bangi 43600,
Selangor, Malaysia
Research Journal of Applied Sciences, Engineering and Technology 2014 13:2701-2704
Received: August 27, 2013 | Accepted: September 07, 2013 | Published: April 05, 2014
Abstract
This study presents the deposition of micro contact probe cell for IC testing deposited by dc sputtering technique on a glass substrate. Micro contact with thickness of 2800-7000 nm were deposited from Copper target at sputtering power of 125 W in argon ambient at a room temperature on a base layer of copper using mask. Then, the micro contacts were investigated by using profilometer. All the obtained results show the potential viability of the novel test fixture and thus solve the limitation of the pogo pin based testing tools by replacing them with the novel IC test fixture as demonstrated in this study.
Keywords:
DC sputtering deposition, micro contact, pogo pin, test socket,
References
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Amin, N. and Z.Y. Lam, 2008. A practical investigation on the root causes of the mechanical damages of pogo pin type test sockets to IC packages in final test. Proceeding of IEEE International Conference on Semiconductor Electronics (ICSE 2008), pp: 393-397.
CrossRef
-
Amit, K.G. and A. Sivakumar, 2005. Single machine scheduling with multiple objectives in semiconductor manufacturing. Int. J. Adv. Manuf. Tech., 26: 950-958.
CrossRef
-
Ehtiatkha, Z., S. Basiri and N. Amin, 2011. Mechanical design and analysis of innovative integrated circuit test socket. Proceeding of IEEE Regional Symposium on Micro and Nan Electronics (RSM), pp: 65-69.
-
Lam, Z.Y., H.W. Koay and N. Amin, 2009. Semiconductor final test fixture design with microstructure alloy contacts using finite element analysis. Proceeding of 11th Electronics Packaging Technology Conference (EPTC '09), pp: 834-837.
CrossRef
-
Teng, H.C., M.K. Chen, C.H. Yeh, Y.J. Huang and S.L. Fu, 2007. Study of contact degradation in final testing for BGA socket. Proceeding of International Conference on Electronic Materials and Packaging, pp: 1-6.
Competing interests
The authors have no competing interests.
Open Access Policy
This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
Copyright
The authors have no competing interests.
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ISSN (Online): 2040-7467
ISSN (Print): 2040-7459 |
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