Abstract

In order to study the effects of numerous variables affecting the reaction rate of heat-resistant flexible modified epoxy resin adhesive, the curing kinetics of polyamide modified epoxy resin was studied. The heat-resistant flexible modified epoxy resin adhesive cured at room-temperature was prepared with epoxy resin, polysulfide rubber and organosilicone as adhesive component, polyamide as main curing agent and addition of different modified filler and the curing agent containing benzene ring structure. The curing kinetics of polyamide modified epoxy resin was studied by Differential Scanning Calorimetry (DSC) at different heating speeds and the characteristic temperatures of the curing process were analyzed and confirmed. the kinetics parameters of activation energy was calculated using Flynn-Wall-Ozawa equation and Kissinger equation, respectively, then the kinetic model of curing reaction was built as (dα)/dt = 4.38×10⁷ exp (-57740/RT) (1-α)^0.93 the results show that the two- parameter model is adequate to represent the curing reaction process, the model can well describe the curing reaction process of the studied resin. The DSC curves obtained using the experimental data show a good agreement with that theoretically calculated. The research results will provide theoretical basis for the choice of manufacturing process and the optimization of processing window.

Keywords:

Curing kinetics , epoxy resin , heat-resistant , modification , organosilicone, polyamide,

References

Competing interests

The authors have no competing interests.

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The authors have no competing interests.